What’s the difference between a MacBook Air and a Pro? Pro
has better performance but more weighty. Why? Because higher performance means
hotter computer. To manage the heat, bulky heat management accessories are
used. It gets weighty. But how about if we make electronics thin, ultra-light
weight and flexible with porous network then it will be ultra-light weight (Argo
dynamically so helpful), cool (because it is flexible) and very importantly it
the embedded micro-air channels can help heat dissipation faster and more. Therefore,
we can potentially reduce the use of bulky heat management accessories and can
get MacBook Pro performance in MacBook Air chassis.
Therefore, at long last the world will have a chance to
think about the cooling effect in our deterministic pattern based porous
network enabled flexing process. Ghoneim’s paper to be published in AIP
Advances.
Enhanced cooling in
mono-crystalline ultra-thin silicon by embedded micro-air channels
Mohamed T. Ghoneim,1 Hossain M. Fahad,1
Aftab M. Hussain,1 Jhonathan P. Rojas,1 Galo A.Torres
Sevilla,1 Nasir Alfaraj,1 Ernesto B. Lizardo,1
Muhammad M. Hussain1,*
1Integrated Nanotechnology Lab, Electrical
Engineering, Computer Electrical Mathematical Science and Engineering Division,
King Abdullah University of Science and Technology (KAUST), Thuwal 23955–6900,
Saudi Arabia
In today’s digital world, complementary metal oxide
semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline
silicon (100) based electronics has resulted in their higher performance but
with increased dynamic and off-state power consumption. Such trade-off has caused
excessive heat generation which eventually drains the charge of battery in
portable devices. The traditional solution utilizing off-chip fans and heat
sinks used for heat management make the whole system bulky and less mobile.
Here we show, an enhanced cooling phenomenon in ultra-thin (>10 mm)
mono-crystalline (100) silicon (detached from bulk substrate) by utilizing
deterministic pattern of porous network of vertical “through silicon” micro-air
channels that offer remarkable heat and weight management for ultra-mobile
electronics, in a cost effective way with 20× reduction in substrate weight and
a 12% lower maximum temperature at sustained loads. We also show the
effectiveness of this event in functional MOS field effect transistors
(MOSFETs) with high-κ/metal gate stacks.
With this paper we should have landed in higher impact journal
but again either the “community” is still learning or in the process of being
neutral or both …
But anyway we are grudgingly happy … congrats to Ghoneim’s 8th
first authored journal paper!