Page 12/05/2015 06:19:17

Ghoneim's (8th first authored) paper on cooling advantage from flexible silicon with porous network is in AIP Advances!

12/5/2015
What’s the difference between a MacBook Air and a Pro? Pro has better performance but more weighty. Why? Because higher performance means hotter computer. To manage the heat, bulky heat management accessories are used. It gets weighty. But how about if we make electronics thin, ultra-light weight and flexible with porous network then it will be ultra-light weight (Argo dynamically so helpful), cool (because it is flexible) and very importantly it the embedded micro-air channels can help heat dissipation faster and more. Therefore, we can potentially reduce the use of bulky heat management accessories and can get MacBook Pro performance in MacBook Air chassis.
 
Therefore, at long last the world will have a chance to think about the cooling effect in our deterministic pattern based porous network enabled flexing process. Ghoneim’s paper to be published in AIP Advances.
 
Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels
 
Mohamed T. Ghoneim,1 Hossain M. Fahad,1 Aftab M. Hussain,1 Jhonathan P. Rojas,1 Galo A.Torres Sevilla,1 Nasir Alfaraj,1 Ernesto B. Lizardo,1 Muhammad M. Hussain1,*
 
1Integrated Nanotechnology Lab, Electrical Engineering, Computer Electrical Mathematical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955–6900, Saudi Arabia
 
In today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 mm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.
 
With this paper we should have landed in higher impact journal but again either the “community” is still learning or in the process of being neutral or both …
 
But anyway we are grudgingly happy … congrats to Ghoneim’s 8th first authored journal paper!