A battle won! Our self-destructible electronics paper has
been accepted to Adv. Mater. Tech. by Wiley-VCH! Since US Defense has expressed
their interest, a handful of research groups have proposed and have been working
on this. In today’s digital age, our increasing dependence on information also
makes us vulnerable to potential invasion of privacy and cyber security.
Consider a scenario in which a hard drive is stolen, lost or misplaced which
contains secured and valuable information. In such a case, it’s important to
have the ability to remotely destroy the sensitive part of the device (e.g.
memory or processor) if it’s not possible to regain it. Many emerging materials
and even some traditional materials like silicon, aluminum, zinc oxide,
tungsten, magnesium, etc. which are often used for logic processor and memory,
show promise to be gradually dissolved upon exposure of various liquid medium.
However, often these wet processes are too slow, fully destructive and require
assistance from the liquid materials and their suitable availability at the
time of need. Here we show joule heating effect induced thermal expansion and
stress gradient between thermally expandable advanced polymeric material and
flexible bulk mono-crystalline silicon (100) to destroy high performance solid
state electronics as needed and in under 10 seconds. We also show different
stimuli assisted smart phone operated remote destruction of such CMOS
Expandable Polymer Enabled Wirelessly Destructible High
Performance Solid State Electronics
Abdurrahman Gumus, Arsalan Alam, Aftab M. Hussain, Kush
Mishra, Irmandy Wicaksono, Galo A. Torres Sevilla, Sohail F. Shaikh, Marlon
Diaz, Seneca Velling, Mohamed T.
Ghoneim, Sally M. Ahmed, Muhammad M. Hussain
Congrats everyone – job well done!