Page 03/20/2017 18:15:44

Adrian's paper in APL!

Hmm, this is one of those papers which was giving us a lot of hard time not because it is a weak one (which we don’t typically write) rather the reviewer was having hard time to understand the fabrication flow. Well, it has always been difficult to understand our flows because we do it in the right way and the way that others can follow (when they grasp it). So, what has been done? Adrian et al. have shown …


Stretchable and Foldable Silicon-Based Electronics

A. C. Cavazos Sepulveda, M.S. Diaz Cordero, A. A. A. Carreño, J. M. Nassar and M. M. Hussain​


Flexible and stretchable semiconducting substrates provide the foundation for novel electronic applications. Usually, ultra-thin, flexible, but often fragile substrates are used in such applications. Here, we describe flexible, stretchable and foldable 500-mm-thick bulk mono-crystalline silicon (100) “islands”  that are interconnected via extremely compliant 30-mm-thick connectors made of silicon. The thick mono-crystalline segments create a stand-alone silicon array that is capable of bending to a radius of 130 µm. The bending radius of the array does not depend on the overall substrate thickness because the ultra-flexible silicon connectors are patterned. We use fracture propagation to release the islands. Because they allow for three-dimensional monolithic stacking of integrated circuits or other electronics without any through-silicon vias, our mono-crystalline islands can be used as a “more-than-Moore” strategy as well as to develop wearable electronics that are sufficiently robust to be compatible with flip-chip bonding.


Adrian – it is time to be patient. As victory comes with patience :)