​Why a sightless person can’t work in fab? How AI driven prosthetic hands can perform micron-scale precision task? How can we assemble electronic ICs like Lego pieces? Sohail et al. have demonstrated pick and place assembly of Lego like electronic ICs on flexible and rigid platform where every single IC has varied shape and architecture at the bottom to replicate DNA like self-assembly.

 

Modular Lego-electronics

Sohail F. Shaikh¹, Mohamed T. Ghoneim ¹, Rabab R. Bahabry ^1,2, Sherjeel M. Khan¹, and Muhammad M. Hussain

Electronic system components have thousands of individual field effect transistors (FETs) interconnected executing dedicated functions. Assembly yield of >80 % will guarantee system failure since a single interconnect failure will result in undesired performance. Hence, a paradigm shift is needed in the self-assembly or integration of state-of-the-art integrated circuits (ICs) for a physically compliant system. Traditionally, most ICs share same geometry with only variations in dimensions and packaging. Here we show, a generic manufacturable method of converting state-of-the-art complementary metal oxide semiconductor (CMOS) based ICs into modular Lego-electronics with unique geometry that are physically identifiable to ease manufacturing and enhance throughput. We grove various geometry at the backside of the silicon die and on the destination site having the same geometry with relaxed dimension (50 mm extra) allows targeted site binding like DNA assembly. Different geometries, angles, heights for different modules provide a unique identity to each of the ICs. The two level geometric combination presented here helps in maintaining the uniqueness of individual module to assemble at exact matching site like a perfect lock-and-key model. The assembled ICs offer uncompromised electrical performance, higher yield and fabrication ease. In future, this method can further be expanded for fluidic assisted self-assembly.

A very important step forward in easy IC assembly.

Kudos to Sohail and all!​